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Enermax ETS-N30-HE Hdt Black CPU Cooler LGA1155 LGA1156 LGA1366 LGA775 AM2 AM3 FM1 FM2 FM2+

Enermax ETS-N30-HE Hdt Black CPU Cooler LGA1155 LGA1156 LGA1366 LGA775 AM2 AM3 FM1 FM2 FM2+ (ENERMAX: ETS-N30-HE)
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ENERMAX ETS-N30-HE 92 x 92 x 25 mm CPU Cooler
Newegg.ca - Once you know, you Newegg! 
$24.99 CAD Buy Now

Product Reviews

Product Features

Compact CPU cooler with 9 cm PWM fan and three 6 mm high-performance heat pipes. Enhanced heat transfer and optimized airflow due to aerodynamic innovations: Stack Effect Flow (SEF) and Vacuum Effect Flow (VEF).

The heat pipes rest directly on the CPU, so that the heat can be dissipated more effectively without additional resistance.


   Product Type:  Processor cooler
   Package Content:  Thermal grease
   Width:  3.6 in
   Depth:  3.1 in
   Height:  5.3 in

Heatsink & Fan
   Compatible With:  Socket 775, Socket 1156, Socket AM2, Socket AM2+, Socket 1366, Socket AM3, Socket 1155, Socket AM3+, Socket FM1, Socket FM2, Socket 1150, Socket FM2+
   Heatsink Material:  Aluminum
   Heatsink Dimensions:  134 mm x 92 mm x 50 mm
   Fan Diameter:  92 mm
   Fan Height:  25 mm
   Rotation Speed:  800-2800 rpm
   Air Flow:  15.9-55.4 cfm
   Air Pressure:  0.36-4.37 mm
   Noise Level:  16 - 28 dBA
   Power Connector:  4-pin PWM plug
   Rated Voltage:  12 V
   Features:  Heat-pipe Direct Touch (H.D.T.) Technology, 3 copper heatpipes (6 mm), Stack Effect (SEF) technology, Vacuum Effect (VEF) technology

   Mounting Kit:  Included

Manufacturer Warranty
   Service & Support:  1 year warranty
   Service & Support Details:  Limited warranty - 1 year

Product Specifications

TypeFan & Heatsinks
Fan Size92 x 92 x 25 mm
CompatibilityIntel LGA 775/1150/1155/1156/1366,
AMD AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+
RPM800 ~2800 r.p.m.
Air Flow15.9~55.4 CFM+/-10%
Noise Level16~28 dBA
Power Connector4 pin PWM connector
Heatsink MaterialCopper Heat Pipes/Aluminum Fins
Physical Spec
Fan Dimensions92 x 92 x 25 mm
Heatsink Dimensions92(L) x 50(W) x 134(H) mm
FeaturesPatented SEF (Stack Effect) design to enhance heat transfer.

Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.

HDT (Heat-pipe direct touch) technology to ensure rapid thermal conduction and eliminate CPU hot spots.

Compact heatsink size for the utmost compatibility.

“1-clip” fan bracket design for user-friendly installation.

High thermal conductivity grease to ensure the best thermal conduction between CPU and the heatsink.

Anti-vibration rubbers prevent fan vibration and absorb noise.

Durable metal bracket for Intel 775/1150/1155/1156/1366 & AMD AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+.

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