Cooler Master RG-ICFN-200G-B1 IceFusion 200G Thermal Compound
VPN: RG-ICFN-200G-B1Vendor: Cooler Master
Price: $14.99 - $14.99 CAD from 1 stores
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 Online |
COOLER MASTER IceFusion 200G Value Pack RG-ICFN-200G-B1 Thermal Compound Newegg.ca - Once you know, you Newegg! |
$14.99 CAD |   |
Product Features
Cooler Master RG-ICFN-200G-B1 IceFusion 200G Thermal Compound
Cooler Master RG-ICFN-200G-B1 IceFusion 200G thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
What it is & Why You Need it:
- High thermal conductivity.
- Low thermal resistance.
- Non-corrosive.
- Best thermal stability in high temperature.
- Excellent adhesion.
- Preserve in room temperature for longer lifespan.
- Up to 500 applications
What's Included
Product Specifications
| Model | |
| Brand | COOLER MASTER |
| Series | IceFusion 200G Value Pack |
| Model | RG-ICFN-200G-B1 |
| SPEC | |
| Specifications | Color: White Specific Gravity @ 25°C: >2.5 Dielectric Constant: >5.1 at 100Hz Dissipation Factor: <0.005 at 100Hz Temperature Stability (°C): -50 ~ 24°C Thermal Conductivity (W/m-K): >1.22 Net Weight: 200 grams / 0.44lbs |
| Features | |
| Features | System builder value size contains enough compound for 500 applications Resealable package High thermal conductivity. Low thermal resistance. Non-corrosive. Best thermal stability in high temperature. Excellent adhesion. Preserve in room temperature for longer lifespan. |
